Effect of Creep Aging Process on Microstructures and Properties of the Retrogressed Al-Zn-Mg-Cu Alloy

The creep aging behaviors of retrogressed Al-Zn-Mg-Cu alloy were studied by uniaxial tensile creep tests at 140 ◦C. The effects of creep aging time and applied stress on microstructures and properties of the studied alloy were investigated by using transmission electron microscope (TEM), hardness, and corrosion resistance tests. Results show that the effects of the creep aging process on microstructures and properties are significant. The size of matrix precipitate (MPt), distance between MPts, width of precipitate-free zone (PFZ), and distance between grain boundary precipitates (GBPs) increase with the increase of creep aging time and applied stress. With the increase of creep aging time and applied stress, the corrosion resistance of the studied alloy improved. After creep aging for 20 h, the electrical conductivity varied with different applied stress from 35.99% to 37.24% International Annealed Copper Standard (IACS), and the exfoliation corrosion (EXCO) resistance increased to the corrosion rating of “EB”, which express slight surface corrosion. Compared with the traditional retrogression and re-aging process (RRA), the retrogression and creep aging process (RCA) can increase the MPt size, widen the precipitates distribution, narrow the PFZ width, and enhance the corrosion resistance while offering the hardness comparable to that of the RRA process.